OXFORD - NGP1000 PECVD

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OXFORD NGP1000 PECVD SYSTEM
Model: Oxford PlasmaPro NGP1000 PECVD
Load Locked Chamber
System PC, Keyboard, Mouse
Windows 7 w/ PC4000 Control Software
X20 PLC
490mm Diameter Aluminum Lower Electrode
Capable of running up 450mm wafers
Up to 400 degrees Celcius
Chamber Heating Kit (Heats Chamber Sidewalls to Minimize Process Deposition)
Dual Frequency RF with Pulsing for Film Stress Control
600W 13.56Mhz HF RF Generator
600W 2Mhz LF RF Generator
Pneumatic Chamber Lift Kit
Operations Manual and Documentation

More information available on request.